part no.: SWL50503-01 specification for top led rev: 1.0 global technology leader kodenshi auk www.kodenshi.cn
page 1 of 6 SWL50503-01 rev: 1.0 features: package dimensions: 1. chip material: ingan 2. emitted color: white 3. resin color: yellow diffuse 4. low power consumption. 5. high efficiency. 6. compatible with infrared and vapor phase reflow solder process. 7. low current requirement. 8. tape/1000pcs. 9. this product don?t contained restriction substance, compliance rohs standard. applications: 1. tv set 2. monitor 3. mobile telephone 4. computer 5. circuit board 6. backlight absolute maximum ratings(ta=25 ) * 1 condition for i fp is pulse of 1/10 duty and 0.1msec width parameter symbol rating unit power dissipation (per die) pd 108 mw forward current (per die) i f 30 ma peak forward current* 1 i fp 100 ma reverse voltage (per die) v r 5 v operating temperature topr -25~+60 storage temperature tstg -40~+85 soldering temperature tsol 260 (for 5 seconds) 1 cathode mark note:1 . all dimensions are in millimeters (inches); 2.tolerances are 0.1mm (0.004inch) unless otherwise noted; 2 3 4 5 6 package outline drawing 5050 top led (5.00x5.00x1.80 mm)
page 2 of 6 rev: 1.0 electrical and optical characteristics(ta=25 ) parameter symbol condition min. typ. max. unit forward voltage* 1 v f i f =20ma 2.8 3.0 3.6 v luminous intensity* 2 iv i f =60ma 4000 5000 7000 mcd reverse current * 1 ir vr=5v - - 10 a x if=60ma 0.28 0.31 0.33 cie.chromatic * 2 coordinates y if=60ma 0.29 0.32 0.35 viewing angle* 2 2 1/2 i f =60ma - 120 - deg * 1 for each die. * 2 when 3 chips are operated simultaneously. typical electro-optical characteristics curves fig.1 relative intensity vs. wavelength 1.0 0.5 0 650 400 wavelength (nm) relative radiant intensity fig.2 forward current derating curve vs. ambient temperature 0 20 ambient temperature ta(c) forward current (ma) 10 20 30 40 50 60 40 60 80 100 fig.3 forward current vs. forward voltage forward voltage (v) foward current (ma) fig.4 relative luminous intensity vs. ambient temperature 0 -20 ambient temperature ta(c) relative luminous intensity 0.5 1.0 1.5 2.0 2.5 3.0 0204060 0 10 20 30 40 50 123 45 -40 fig.5 relatove luminous intensity vs. forward current forward current (ma) relative luminous intensity fig.6 radiation diagram relative radiant intensity 0 10 0.5 1.0 1.5 2.0 20 30 40 50 0.1 0.3 0.5 0.2 0.4 0.6 0.7 0.8 0.9 1.0 90 80 70 60 50 40 30 20 10 0 500 600 SWL50503-01 5050 top led (5.00x5.00x1.80 mm)
page 3 of 6 rev: 1.0 bin limits 1. intensity bin limits (at if= 60ma) bin code min. (mcd) max. (mcd) t1 4000 5000 t2 5000 6000 u1 6000 7000 2. voltage bin limits (at if= 20ma) per die bin code min. (v) max. (v) g 2.8 3.0 h 3.0 3.2 i 3.2 3.4 j 3.4 3.6 3. color bin limits (at if= 60ma) x 0.255 0.264 0.28 0.27 y 0.245 0.267 0.248 0.23 x 0.264 0.283 0.296 0.28 y 0.267 0.305 0.276 0.248 x 0.283 0.304 0.307 0.287 y 0.305 0.33 0.315 0.295 x 0.304 0.33 0.33 0.307 y 0.33 0.36 0.339 0.315 x 0.287 0.307 0.311 0.296 y 0.295 0.315 0.294 0.276 x 0.307 0.33 0.33 0.311 y 0.315 0.339 0.318 0.294 x 0.33 0.361 0.355 0.33 y 0.36 0.385 0.35 0.318 w4 w5 w6 cie color ranks w0 w1 w2 w3 SWL50503-01 5050 top led (5.00x5.00x1.80 mm)
page 4 of 6 rev: 1.0 0.18 0.19 0.20 0.21 0.22 0.23 0.24 0.25 0.26 0.27 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 0.37 0.38 0.39 0.40 0.41 0.42 0.18 0.20 0.22 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 bin : x x - x intensity bin code v oltage bin code color bin code w0 w1 w2 w3 w4 w5 w6 SWL50503-01 5050 top led (5.00x5.00x1.80 mm)
page 5 of 6 rev: 1.0 taping feed direction feed direction notes: 1. all dimensions are in millimeters(inches) tolerance is 0.1mm unless otherwise noted . 2. 1000pcs/tape packing notes: 1. all dimensions are in millimeters, to lerance is 2.0mm unless otherwise noted. 2. specifications are subject to c hange without notice. 3. 1bag:1000pcs, 1box:5,000pcs. SWL50503-01 5050 top led (5.00x5.00x1.80 mm)
page 6 of 6 rev: 1.0 suggest soldering pad dimensions: recommended soldering pattern for reflow soldering notes: 1. all dimensions are in millimeters (inches). suggestion ir reflow profile for pb free process more than 220 10--40 sec. 220 peak temp. 255 250 peak temp. 255 255 10 sec. pre-heat 140 --200 60--120 sec. time dgree.c. recommended profile between assemble and heat-resistance line the profile is available that must to use sna g ( x=3.3-3.8 ) cu (y =0.2-0.7 ) solder p aste 400.0 350.0 300.0 250.0 200.0 150.0 100.0 50.0 0.0 300.0 275.0 250.0 225.0 200.0 175.0 150.0 125.0 100.0 75.0 50.0 25.0 temperature( ) 0.0 SWL50503-01 5050 top led (5.00x5.00x1.80 mm)
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